林 敏 教授/博导

办公室:

上海大学宝山校区东区通信B521

通信地址(邮政编码):

上海市南陈路333上海大学通信学院(200444

电话:

  

电子邮件:

mlin99@shu.edu.cn

个人主页:

https://scie.shu.edu.cn/Prof/linmin.htm

    

个人简介(简历)

  

林敏教授是无线通信集成电路和SOI高可靠集成电路设计方面的专家。20042008年,担任日本OKI公司新加坡芯片设计中心的高级工程师,设计经理,主要致力于ETCWiFiUWB和其他无线通信芯片的设计和量产工作。20082012年,作为联合创始人,创办了一家无线芯片设计公司,担任研发团队总负责人和技术委员会主席,领导开发了GPSGPS/BeiDouWiFi,等射频和通信类集成电路芯片。2012年,该公司被上市公司收购。2012年,被中国科学院聘任为研究员和博导,担任中科院SOI重大专项首席科学家。2014年,获选为“中国科学院百人计划”学者。2018年,被上海大学聘为特聘教授和博导,组建了“先进系统芯片与物联网技术实验室(Advanced SoC and IoT Technology Lab : ASITLAB)”,担任实验室主任。目前,主要致力于新一代IR-UWB无线通信系统芯片,超低功耗物联网通信芯片,毫米波高速通信与传感芯片等领域的研究。林敏教授出版学术专著一本,在IEEE国际期刊和国家会议上发表学术论文超过50篇。

    

Professor Lin is expert in wireless communication integrated circuit design and SOI device & circuits in harsh environment. From 2004 to 2008, he worked for OKI Technology Center in Singpore as a senior staff engineer, focused in ETC, WiFi, UWB and other wireless communications chip design. From 2008 to 2012, he co-founded an wireless communication chip startup company and developed GPS, GPS/BD dual-mode, WiFi and other radio frequency integrated circuits. He joined the Shanghai Institute of Microsystem and Information Technology of the Chinese Academy of Sciences in 2012 as a professor. Since 2018, Prof.Lin joined Shanghai University and established "Advanced SoC and IoT Technology Lab(ASITLAB)". His current research interest is focused on the IR-UWB communication system and chip design, low-power IoT wireless communication IC design, high speed millimeter wave circuit and system design. Prof. Lin has published a book and more than 50 papers on the IEEE international journals and conferences.

   

科研方向

无线通信系统芯片设计、低功耗物联网系统芯片设计、模拟射频集成电路设计、高可靠集成电路设计。

   

本科生教学

 “万物互联芯技术”    新生研讨课     冬季学期

 “通信电子线路”      专业基础课     春季学期

优秀本科生项目,每年秋季学期,会选拔4~6名优秀本科生,参与实验室的芯片设计项目的学习和研究工作。该项目对于有志于通信芯片设计的本科生同学是一个很好的学习和训练机会,为他们研究生阶段进入芯片设计领域的学习和研究工作奠定坚实的理论知识基础和培养全面的工程实践技能。

     

研究生培养

研究方向   模拟射频集成电路设计

研究方向二:   通信算法与协议的集成电路设计

  

研究生教学:  “通信与信息技术进展”    春季学期

 

承担或参与的科研项目

1     国家重点研发计划项目, “超低功耗智能体域网节点芯片”

2     重大横向项目, “CMOS单片集成软件无线电收发机系统芯片”

 

学术论文及授权发明专利

1     A Fully Integrated K-Band Dual Down-Conversion Receiver for Radar Applications in 90 nm CMOSIEEE ACCESS2020

2     Single-event transient characterization of a radiation-tolerant charge-pump phase-locked loop fabricated in 130 nm PD-SOI technologyIEEE Transactions on Nuclear Science

2017

3     Analysis of single-event effects in a radiation-hardened low-jitter PLL under heavy ion and pulsed laser irradiationIEEE Transactions on Nuclear Science2016

4     Total ionizing dose sensitivity of a radiation-tolerant phase-locked loop in a 130 nm SOI technologyRadiation and Its Effects on Components and Systems (RADECS)2016

5     A CMOS Programmable Gain Amplifier with a Novel DC-offset Cancellation TechniqueCustom Integrated Circuits Conference (CICC)2010

6     A novel IP3 boosting technique using feedforward distortion cancellation method for 5 GHz CMOS LNAAnalog Integrated Circuits and Signal Processing, 2006

7     A novel IP3 boosting technique using feedforward distortion cancellation method for 5 GHz CMOS LNA, IEEE MTT-S International Microwave Symposium Digest, 2003

8     A Widely Tunable Active-RC Complex Filter for Multi-Mode Wireless Receivers with Automatic Frequency Tuning, IEICE Electronics Express, 2016

9     High throughput and low complexity implementation of NB-LDPC decoder based on EMS algorithm, IEICE Electronics Express, 2016

10   VHDL数字系统设计与高层次综合》    电子工业出版社  林敏  编著